Paper Image

Superconducting interconnects for cryoelectronics

Published on:

11 August 2023

Primary Category:


Paper Authors:

Ivan Filippov,

Alexandr Anikanov,

Aleksandr Rykov,

Alexander Mumlyakov,

Maksim Shibalov,

Igor Trofimov,

Nikolay Porokhov,

Yuriy Anufriev,

Michael Tarkhov


Key Details

Investigated methods to produce superconducting interconnects between layers in cryoelectronics

Etched high aspect ratio vias in silicon using Bosch process

Implemented 'supercycles' of oxidation and etching to smooth via sidewalls

Achieved superconducting contacts after depositing niobium into ultra-smooth vias

AI generated summary

Superconducting interconnects for cryoelectronics

This paper investigates methods to fabricate smooth-walled, superconducting through-silicon vias (TSVs) to enable high-density interconnects between layers in cryoelectronic devices like quantum computers. A process combining deep reactive ion etching and 'supercycles' of oxidation and etching produced ultra-smooth vertical vias that enabled conformal niobium deposition and superconducting contacts between layers.

Answers from this paper


No comments yet, be the first to start the conversation...

Sign up to comment on this paper

Sign Up